Name: HIGH TEMPERATURE COFIRED CERAMIC HTCC for IC packagemicrowave device packageSMT Microwave Device Packages
Brand: Coraynic
Price: 5 USD

Categorías de Producto

Materiales de cerámica de BeO

[4]

Si3N4 de cerámica

[2]

LTCC

[3]

AlN de cerámica

[2]

HTCC

[2]

Resistores del poder del RF

[7]

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Tecnología de Coraynic limitada

Ciudad:shenzhen

Provincia / Estado:guangdong

País/Región:china

Persona de contacto:MrRoy Luo

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Brand Name :Coraynic

Model Number :HTCC

Certification :CE

Place of Origin :China

MOQ :50 pcs

Price :US$5

Payment Terms :L/C, T/T, Western Union

Supply Ability :3000pcs per month

Delivery Time :3 weeks

Packaging Details :reel package,sealed bag packing

Plate size :Max:85*85mm

Substrate thickness :0.3~3.5mm

Cavity layer thickness :60% of substrate thickness (0.18~2.1)

Bore hole to Edge :2 times of hole dia

Via hole diameter :0.12 & 0.16

Via to via centerline :3 times of hole dia

HTCC-CQFN pakcgae :Lead pitch: 0.5m、0.635m；

Frequency :DC 30G

Application 1 :For MIC &RF HMIC

Application 2 :Optoelctronic Device Packages

Application 3 :MCP、SiP package

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